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After ditching its Exynos chips, Samsung will join forces with Google for a new in-house SoC

After ditching its Exynos chips, Samsung will join forces with Google for a new in-house SoC

Samsung, Google and AMD have been working together since last summer on the design of a futuristic chip that will power smartphones in the Korean manufacturer’s Galaxy S range.

A great partnership whose goal is to tickle Apple and its Model A chips on its own turf, or even specialists like Qualcomm and Mediatek by 2025. A way for Samsung to try to make people forget the relative failure of its Exynos processors.

Failure but not defeat

Exynos 2200 chips that I equipped Samsung Galaxy S22 phone It was disappointing in terms of performance. So much so, that the South Korean giant is now expected to instead turn 100%. Snapdragon 8 Gen 2 For the soon to be announced Galaxy S23. But this does not prevent the manufacturer from continuing to work on the SoC (system on a chip) House of Performance.

The company has already been working with Google and AMD on various projects. Google designs the Tensor chips that power smartphones pixel range ; and AMD for the Exynos chipset GPU. But the three players decided to join forces last summer to develop a new SoC dedicated to Samsung’s future high-end smartphones.

chip for its flagship

according to Various leaks These chips have been released since this summer, and will not arrive until at least 2025. According to rumors, in particular, they will consist of an ARM Cortex-X core and an AMD graphics processor. Samsung has created a real army to achieve its goals. In all, more than 1,000 internal staff, from the LSI and Mobile Experience Group divisions, will be involved in what could be called a ‘Platform One Dream Team’.

The chips could begin production next year for use in the Galaxy S flagship phones in 2025. Samsung and its internal SoC, given its potential goals, would be a serious technology competitor to Apple, which is also developing chips internally. on their iPhones. Samsung chips could also be based on a 3nm etching, and the group has already started working on the matter.

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